Home / Semester 2 / ECE038

SEMICONDUCTOR MANUFACTURING PROCESS

ECE038 2 Credits L:2 T:0 P:0

This course covers the fundamental processes involved in semiconductor manufacturing, including material fabrication, crystal growth techniques, oxidation, doping, lithography, thin film deposition, metallization, and the final assembly and packaging of VLSI chips.

Study Units

Unit 1

Electronic materials and Crystal growth

Unit 2

Oxidation process for semiconductors

Unit 3

Lithography

Unit 4

Thin-film-deposition

Unit 5

Metallization

Unit 6

Assembly Techniques and Packaging of VLSI chips

Continuous Assessment

3 components

Test 33.33%

6 questions of 5 marks each to assess the ability to understand fabrication and crystal growth techniques.

Week 4/5
Presentation - Individual 33.33%

The topics should be based on the latest and emerging technologies. Marks distribution : Ppt contents (15) and Presentation/Explanation (15).

Week 8/9
Poster Presentation 33.33%

Outdoor activity: The topics should be based on the latest and emerging technologies in IC fabrication. Evaluation will be done by Nominated Panel Members with marks distribution of Poster content (15) and Presentation/Explanation (15).

Week 10/12

Exams & Practice

Mid Term Examination

Mid-semester comprehensive evaluation

20%
Coming Soon

End Term Examination

Final semester comprehensive evaluation

50%

Type: Examination

Coming Soon

ECE038 - FAQs

How many units are in ECE038?

ECE038 has 6 units. Each unit includes detailed notes and MCQ practice questions.

What exam resources are available for ECE038?

Unit-wise notes and MCQ practice are available. Exam resources coming soon.

How to prepare for ECE038 exams?

Study each unit's notes thoroughly, practice MCQs to test understanding, and attempt mock tests before exams. Focus on important topics and previous year questions.